Join us at the TSMC Open Innovation Platform (OIP) in North America, where innovation meets excellence. SmartSoC Solutions is excited to be part of this prestigious event, showcasing our cutting-edge technologies and industry-leading solutions.
Why Visit Us?
– Innovative Solutions: Discover how SmartSoC is driving the future of semiconductor design with advanced AI-driven methodologies and state-of-the-art IPs.
– Expert Insights: Engage with our team of experts to explore customized solutions that can accelerate your product development and enhance performance.
– Live Demonstrations: Experience our latest tools and technologies in action. Witness firsthand how our solutions can revolutionize your design process.
– Exclusive Networking: Connect with industry leaders, peers, and partners. Exchange ideas and explore potential collaborations that can take your projects to the next level.
Don’t Miss Out!
This is your opportunity to see how SmartSoC Solutions is shaping the future of semiconductor innovation. We invite you to visit us at Booth #603 to learn more about our offerings and how we can help you achieve your goals.
Mark your calendar and be part of this transformative experience!
About TSMC 2024 Open Innovation Platform Ecosystem Forum
The TSMC Open Innovation Platform (OIP) North America Ecosystem Forum is a technical conference that brings together the semiconductor design community. The OIP is a design technology infrastructure that helps reduce design barriers and improve the success of first-time silicon.
SmartSoC is thrilled to be exhibiting at TSMC OIP – North America
SmartSoC Solutions is emerging as a leader in providing engineering solutions worldwide. We offer end-to-end Semiconductor, Embedded, and IT services to design and build next-generation leadership products under one roof. And allowing clients to achieve both quick wins and long-term results. Our goal is to be an extended arm of engineering product and IT companies and ensure good quality productization cost-effectively.
SmartSoC Solutions offers the following end-to-end and partial solutions: